Used in semiconductor manufacturing as a bonding material for connecting silicon chips to lead frames due to its high purity and excellent electrical conductivity. Commonly applied in microelectronics for wire bonding and flip-chip assembly where reliability and minimal resistance are critical. Also utilized in aerospace and high-reliability electronics for its resistance to oxidation and stable performance under thermal cycling. Frequently employed in research and development for thin-film deposition techniques and as a calibration standard in electron microscopy. Its extreme malleability and consistent thickness make it ideal for precision applications in sensors and detectors.