Indium foil is widely used in applications requiring excellent thermal and electrical conductivity, combined with high ductility and low hardness. Its ability to conform easily under pressure makes it ideal for use in thermal interface materials, where it fills microscopic gaps between heat-generating components and heat sinks in high-performance electronics and optoelectronic devices. It is commonly employed in cryogenic and vacuum environments due to its ability to form reliable cold welds and hermetic seals. In semiconductor manufacturing, indium foil acts as a bonding layer between components that require minimal interdiffusion and high-purity connections. Due to its softness and malleability, it is also used in sealing applications for high-vacuum systems, especially in research and aerospace industries. Additionally, it serves as a diffusion barrier and adhesion layer in multilayer electronic packaging and flip-chip assembly. Indium foil is favored in low-temperature soldering processes where traditional solders may not perform well, and it plays a critical role in infrared detector assemblies and superconducting radio frequency cavities.