Copper superfine powder
99.9% metals basis, average particle size: 10 μm, nearly spherical
- Product Code: 157562
CAS:
7440-50-8
| Molecular Weight: | 63.55 g./mol | Molecular Formula: | Cu |
|---|---|---|---|
| EC Number: | 231-159-6 | MDL Number: | MFCD00010965 |
| Melting Point: | 1083.4 °C(lit.) | Boiling Point: | 2580 °C |
| Density: | 8.94 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature |
Product Description:
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical and thermal conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, and touch screen panels. Its high surface area enhances sintering at lower temperatures, making it ideal for advanced packaging and die-attach materials in semiconductor devices.
In additive manufacturing, especially in 3D printing of electronic circuits, copper superfine powder enables precise deposition and strong conductive traces. It is also utilized in catalyst applications, particularly in chemical synthesis and environmental remediation, where its reactivity improves process efficiency.
Additionally, this powder is incorporated into antimicrobial coatings and materials, leveraging copper’s natural biocidal properties for use in medical devices, textiles, and hygienic surfaces. Its fine particle size ensures uniform dispersion and sustained performance in composite materials.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 100.000 G | 10-20 days | ฿2,780.00 |
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| 500.000 G | 10-20 days | ฿9,680.00 |
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Copper superfine powder
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical and thermal conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, and touch screen panels. Its high surface area enhances sintering at lower temperatures, making it ideal for advanced packaging and die-attach materials in semiconductor devices.
In additive manufacturing, especially in 3D printing of electronic circuits, copper superfine powder enables precise deposition and strong conductive traces. It is also utilized in catalyst applications, particularly in chemical synthesis and environmental remediation, where its reactivity improves process efficiency.
Additionally, this powder is incorporated into antimicrobial coatings and materials, leveraging copper’s natural biocidal properties for use in medical devices, textiles, and hygienic surfaces. Its fine particle size ensures uniform dispersion and sustained performance in composite materials.
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