Copper superfine powder
99.9% metals basis, 200 mesh
- Product Code: 158431
Alias:
Copper powder/copper sheet/high-purity copper/nanocopper powder
CAS:
7440-50-8
| Molecular Weight: | 63.55 g./mol | Molecular Formula: | Cu |
|---|---|---|---|
| EC Number: | 231-159-6 | MDL Number: | MFCD00010965 |
| Melting Point: | 1083.4 °C(lit.) | Boiling Point: | 2580 °C |
| Density: | 8.94 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature |
Product Description:
Used as a conductive filler in electronic inks and pastes for printed circuit boards and flexible electronics due to its high surface area and conductivity. Applied in the production of multilayer ceramic capacitors (MLCCs) as an internal electrode material. Utilized in thermal conductive adhesives and coatings for heat dissipation in electronic devices. Employed in catalysis for chemical synthesis, especially in coupling reactions and oxidation processes. Incorporated into antimicrobial coatings and materials because of copper’s biocidal properties. Also used in powder metallurgy to produce copper-based sintered components with enhanced density and strength.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 G | 10-20 days | ฿660.00 |
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| 100.000 G | 10-20 days | ฿1,250.00 |
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| 500.000 G | 10-20 days | ฿3,060.00 |
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| 2500.000 G | 10-20 days | ฿12,610.00 |
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Copper superfine powder
Used as a conductive filler in electronic inks and pastes for printed circuit boards and flexible electronics due to its high surface area and conductivity. Applied in the production of multilayer ceramic capacitors (MLCCs) as an internal electrode material. Utilized in thermal conductive adhesives and coatings for heat dissipation in electronic devices. Employed in catalysis for chemical synthesis, especially in coupling reactions and oxidation processes. Incorporated into antimicrobial coatings and materials because of copper’s biocidal properties. Also used in powder metallurgy to produce copper-based sintered components with enhanced density and strength.
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