Copper superfine powder

99.9% metals basis, 200 mesh

Reagent Code: #158431
label
Alias Copper powder/copper sheet/high-purity copper/nanocopper powder
fingerprint
CAS Number 7440-50-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 63.55 g/mol
Formula Cu
badge Registry Numbers
EC Number 231-159-6
MDL Number MFCD00010965
thermostat Physical Properties
Melting Point 1083.4 °C(lit.)
Boiling Point 2580 °C
inventory_2 Storage & Handling
Density 8.94 g/mL at 25 °C(lit.)
Storage Room temperature

description Product Description

Used as a conductive filler in electronic inks and pastes for printed circuit boards, flexible electronics, semiconductors, and thin-film solar cells due to its high surface area and conductivity, offering cost advantages over silver or gold. Applied in the production of multilayer ceramic capacitors (MLCCs) as an internal electrode material. Utilized in thermal conductive adhesives and coatings for heat dissipation in electronic devices. Employed in catalysis for chemical synthesis, especially in coupling reactions and oxidation processes requiring high surface area. Incorporated into antimicrobial coatings and materials because of copper’s biocidal properties. Also used in powder metallurgy to produce copper-based sintered components with enhanced density and strength. Additionally, applied in surface coatings to enhance corrosion resistance and rust prevention on metal surfaces, and in nanocomposites to improve mechanical and electrical properties of plastics or resins.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 25g
10-20 days ฿660.00
inventory 100g
10-20 days ฿1,250.00
inventory 500g
10-20 days ฿3,060.00
inventory 2.5kg
10-20 days ฿12,610.00

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