Copper superfine powder
99.9% metals basis, 200 mesh
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Used as a conductive filler in electronic inks and pastes for printed circuit boards, flexible electronics, semiconductors, and thin-film solar cells due to its high surface area and conductivity, offering cost advantages over silver or gold. Applied in the production of multilayer ceramic capacitors (MLCCs) as an internal electrode material. Utilized in thermal conductive adhesives and coatings for heat dissipation in electronic devices. Employed in catalysis for chemical synthesis, especially in coupling reactions and oxidation processes requiring high surface area. Incorporated into antimicrobial coatings and materials because of copper’s biocidal properties. Also used in powder metallurgy to produce copper-based sintered components with enhanced density and strength. Additionally, applied in surface coatings to enhance corrosion resistance and rust prevention on metal surfaces, and in nanocomposites to improve mechanical and electrical properties of plastics or resins.
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