Copper superfine powder
99.9% metals basis, 1μm
- Product Code: 158432
Alias:
Copper powder/copper sheet/high-purity copper/nanocopper powder
CAS:
7440-50-8
| Molecular Weight: | 63.55 g./mol | Molecular Formula: | Cu |
|---|---|---|---|
| EC Number: | 231-159-6 | MDL Number: | MFCD00010965 |
| Melting Point: | 1083.4 °C(lit.) | Boiling Point: | 2580 °C |
| Density: | 8.94 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature |
Product Description:
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, and touch screens. Its high surface area enhances performance in catalytic applications, especially in chemical synthesis and environmental remediation processes. The powder is also utilized in advanced composites and antimicrobial coatings, taking advantage of copper’s natural biocidal properties. In additive manufacturing and 3D printing, it enables the fabrication of complex conductive structures. Additionally, it plays a role in powder metallurgy for manufacturing high-performance copper-based parts with improved density and strength.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 G | 10-20 days | ฿1,360.00 |
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| 500.000 G | 10-20 days | ฿14,580.00 |
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| 100.000 G | 10-20 days | ฿4,190.00 |
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Copper superfine powder
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, and touch screens. Its high surface area enhances performance in catalytic applications, especially in chemical synthesis and environmental remediation processes. The powder is also utilized in advanced composites and antimicrobial coatings, taking advantage of copper’s natural biocidal properties. In additive manufacturing and 3D printing, it enables the fabrication of complex conductive structures. Additionally, it plays a role in powder metallurgy for manufacturing high-performance copper-based parts with improved density and strength.
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