Copper superfine powder
99.9% metals basis, -300 mesh, nearly spherical
- Product Code: 163082
CAS:
7440-50-8
| Molecular Weight: | 63.55 g./mol | Molecular Formula: | Cu |
|---|---|---|---|
| EC Number: | 231-159-6 | MDL Number: | MFCD00010965 |
| Melting Point: | 1083.4 °C(lit.) | Boiling Point: | 2580 °C |
| Density: | 8.94 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature |
Product Description:
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, and touch screen panels. Its high surface area enhances sintering at lower temperatures, making it ideal for low-temperature manufacturing processes.
In additive manufacturing and 3D printing, copper superfine powder is used to fabricate complex metal parts with high thermal and electrical performance. It is also employed in catalyst applications, especially in chemical synthesis and environmental remediation, where its reactivity improves process efficiency.
Additionally, it finds use in antimicrobial coatings for medical devices and surfaces, leveraging copper’s natural biocidal properties. The fine particle size allows for uniform dispersion in polymers and composites, improving thermal conductivity and mechanical strength in advanced materials.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | solid |
| Purity (%) | 99.9-100 |
| Particle Size | greater than or equal to 300mesh |
| Infrared Spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 100.000 G | 10-20 days | ฿1,660.00 |
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| 500.000 G | 10-20 days | ฿4,000.00 |
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| 2500.000 G | 10-20 days | ฿15,200.00 |
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Copper superfine powder
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, and touch screen panels. Its high surface area enhances sintering at lower temperatures, making it ideal for low-temperature manufacturing processes.
In additive manufacturing and 3D printing, copper superfine powder is used to fabricate complex metal parts with high thermal and electrical performance. It is also employed in catalyst applications, especially in chemical synthesis and environmental remediation, where its reactivity improves process efficiency.
Additionally, it finds use in antimicrobial coatings for medical devices and surfaces, leveraging copper’s natural biocidal properties. The fine particle size allows for uniform dispersion in polymers and composites, improving thermal conductivity and mechanical strength in advanced materials.
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