Tin
99.99% metals basis
Reagent
Code: #239828
CAS Number
7440-31-5
blur_circular Chemical Specifications
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Molecular Information
Weight
118.71 g/mol
Formula
Sn
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Registry Numbers
EC Number
231-141-8
MDL Number
MFCD00133862
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Physical Properties
Melting Point
232 °C(lit.)
Boiling Point
2270 °C(lit.)
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Storage & Handling
Density
7.310 g/mL at 25 °C(lit.)
Storage
Room temperature
description Product Description
Tin is widely used in the manufacturing of solder for electronic circuits due to its low melting point and excellent conductivity when alloyed with lead or as lead-free alternatives. It serves as a protective coating for steel in food packaging and construction materials, commonly known as tinplate, preventing corrosion and extending shelf life of canned goods. Tin is a key component in the production of bronze and pewter, used in bearings, bushings, and decorative items. In the chemical industry, tin compounds act as catalysts in polymer production, especially in silicone and polyester materials. Organotin compounds are utilized in stabilizers for PVC plastics, improving heat and light resistance. Additionally, tin dioxide is employed in sensors, ceramics, and as a conductive coating in glass and mirror production.
format_list_bulleted Product Specification
| Test Parameter | Specification |
|---|---|
| Total Metallic Impurities | 0-200 ppm |
| Purity | 99.99-100% |
| Appearance | Silvery white metal powder |
| ICP | Conforms to Structure |
| X-ray Diffraction | Conforms to Structure |
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