Copper wire, 0.2mm diameter, 99.999% metals basis

0.2mm diameter, 99.999% metals basis

Reagent Code: #248470
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CAS Number 7440-50-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 63.55 g/mol
Formula Cu
badge Registry Numbers
EC Number 231-159-6
MDL Number MFCD00010965
thermostat Physical Properties
Melting Point 1083.4 °C(lit.)
Boiling Point 2580 °C
inventory_2 Storage & Handling
Density 8.94 g/mL at 25 °C(lit.)
Storage Room temperature

description Product Description

Used as a conductive material in precision electronic circuits and microelectronic devices due to its high purity and consistent diameter. Ideal for wire bonding in semiconductor assembly, sensor fabrication, and experimental setups requiring minimal electrical resistance. Commonly employed in research laboratories for creating custom coils, antennas, and interconnects in prototype development. Its ultra-high purity ensures low signal loss and excellent thermal conductivity, making it suitable for sensitive analytical instruments and cryogenic applications.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 10m
10-20 days ฿5,280.00

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