Copper wire, 0.2mm diameter, 99.999% metals basis
0.2mm diameter, 99.999% metals basis
Reagent
Code: #248470
CAS Number
7440-50-8
blur_circular Chemical Specifications
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Molecular Information
Weight
63.55 g/mol
Formula
Cu
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Registry Numbers
EC Number
231-159-6
MDL Number
MFCD00010965
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Physical Properties
Melting Point
1083.4 °C(lit.)
Boiling Point
2580 °C
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Storage & Handling
Density
8.94 g/mL at 25 °C(lit.)
Storage
Room temperature
description Product Description
Used as a conductive material in precision electronic circuits and microelectronic devices due to its high purity and consistent diameter. Ideal for wire bonding in semiconductor assembly, sensor fabrication, and experimental setups requiring minimal electrical resistance. Commonly employed in research laboratories for creating custom coils, antennas, and interconnects in prototype development. Its ultra-high purity ensures low signal loss and excellent thermal conductivity, making it suitable for sensitive analytical instruments and cryogenic applications.
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