Microencapsulated Phase Change Material Powder (PCM, 37C) is a microencapsulated phase change material designed around a nominal phase-change temperature of 37C.
The PCM core absorbs and releases latent heat around its transition range, while the shell helps keep the material contained as a processable white to off-white microencapsulated powder. It is intended for research, prototype development, and industrial formulation trials where thermal buffering or temperature regulation is required.
Product Description:
Use this grade for functional fillers for coatings, composite materials, thermal storage panels, polymer systems, and prototype heat-buffering materials. The product should be evaluated in the actual binder, substrate, and processing temperature profile before scale-up.
Phase Change Temperature:
Nominal PCM transition temperature: 37C. Confirm actual onset, peak, and enthalpy by DSC testing for critical applications.
Usage:
Typical starting range: 1-20% depending on heat-capacity target and mechanical requirements.
Mixing Method:
Pre-disperse in the target binder or carrier, then mix into the main system with moderate shear. Avoid milling or aggressive high-shear processing after the microcapsules are added.
Product Characteristics:
Appearance: white to off-white microencapsulated powder
Composition: proprietary microencapsulated PCM system
Solubility / Dispersion:
Dispersible in water or compatible binders depending on grade and formulation. The microcapsules are not molecularly soluble; maintain uniform suspension during processing.
Storage:
Store tightly closed at room temperature in a dry, ventilated area. Avoid freezing, excessive heat, direct sunlight, and mechanical crushing.
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Microencapsulated Phase Change Material Powder (PCM, 37C) is a microencapsulated phase change material designed around a nominal phase-change temperature of 37C.
The PCM core absorbs and releases latent heat around its transition range, while the shell helps keep the material contained as a processable white to off-white microencapsulated powder. It is intended for research, prototype development, and industrial formulation trials where thermal buffering or temperature regulation is required.
Product Description:
Use this grade for functional fillers for coatings, composite materials, thermal storage panels, polymer systems, and prototype heat-buffering materials. The product should be evaluated in the actual binder, substrate, and processing temperature profile before scale-up.
Phase Change Temperature:
Nominal PCM transition temperature: 37C. Confirm actual onset, peak, and enthalpy by DSC testing for critical applications.
Usage:
Typical starting range: 1-20% depending on heat-capacity target and mechanical requirements.
Mixing Method:
Pre-disperse in the target binder or carrier, then mix into the main system with moderate shear. Avoid milling or aggressive high-shear processing after the microcapsules are added.
Product Characteristics:
Appearance: white to off-white microencapsulated powder
Composition: proprietary microencapsulated PCM system
Solubility / Dispersion:
Dispersible in water or compatible binders depending on grade and formulation. The microcapsules are not molecularly soluble; maintain uniform suspension during processing.
Storage:
Store tightly closed at room temperature in a dry, ventilated area. Avoid freezing, excessive heat, direct sunlight, and mechanical crushing.
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