Used as a nanofiller in polymer composites to enhance thermal stability and mechanical strength. Improves flame retardancy and reduces flammability when added to epoxy, silicone, and other resins. Commonly applied in coatings and encapsulants for electronics due to its ability to form protective, heat-resistant layers. Enhances UV resistance in clear coatings and adhesives. Also utilized in low-dielectric-constant materials for microelectronics. Its cage-like structure allows for molecular-level dispersion, improving material performance without significantly increasing weight.