Used as a reactive diluent and crosslinking agent in epoxy resin systems to reduce viscosity and improve processability without sacrificing thermal or mechanical properties. Enhances the flexibility and toughness of cured resins while maintaining chemical resistance. Commonly applied in high-performance composites, coatings, adhesives, and electronic encapsulants where thermal stability and durability are critical. Also utilized in the synthesis of specialty polymers and as a building block in UV-curable formulations due to its unsaturated functionality.