Used primarily as a reactive diluent and crosslinking agent in epoxy resin systems. Enhances flexibility and impact resistance of coatings, adhesives, and composites without significantly lowering glass transition temperature. Its long aliphatic chain improves resin compatibility and reduces viscosity, aiding in the processing of high-performance materials. Commonly applied in automotive, aerospace, and electronic encapsulation where durability and thermal stability are critical. Also utilized in UV-curable formulations due to its epoxide functionality, enabling efficient curing under radiation.