Used primarily as a reactive diluent and crosslinking agent in epoxy resin systems, enhancing flexibility and reducing viscosity without compromising thermal stability. Commonly applied in high-performance coatings, adhesives, and composite materials where improved toughness and resistance to thermal cycling are required. Also utilized in UV-curable formulations due to its ability to participate in radical polymerization, making it suitable for inks, electronics encapsulation, and fiber-reinforced plastics. Its allyl functionality provides excellent reactivity and network formation in thermoset applications.