FT709 is primarily used in advanced semiconductor manufacturing processes, particularly in photolithography. It functions as a key component in photoresist formulations, enabling high-resolution patterning essential for producing nanoscale features on silicon wafers. Its high sensitivity to extreme ultraviolet (EUV) light makes it suitable for next-generation chip fabrication, supporting the development of faster and more efficient electronic devices. Additionally, FT7079 exhibits excellent etch resistance and thermal stability, which improves pattern fidelity during plasma etching and other backend processing steps. Its compatibility with existing lithography tools allows for integration into current production lines with minimal modifications, making it valuable in the ongoing miniaturization of integrated circuits.