Used as a crosslinking agent in silicone curing systems, particularly in addition-cure silicones for high-performance sealants and encapsulants. Enhances thermal stability and reduces volatility in silicone formulations due to its low molecular weight and reactive vinyl groups. Commonly applied in electronics and aerospace industries where durable, heat-resistant bonds are required. Also serves as a modifier in silicone coatings to improve adhesion and flexibility on difficult substrates.