W solution is widely used in metal surface treatment processes, particularly in the electronics and semiconductor industries. It serves as a critical cleaning and passivation agent during the fabrication of integrated circuits. The solution effectively removes trace metal contaminants and organic residues from silicon wafers, ensuring high surface purity and enhancing the performance and reliability of electronic devices. It is also employed in the preparation of metal substrates for subsequent coating or plating operations, improving adhesion and corrosion resistance. Due to its controlled reactivity, W solution is favored in precision applications where minimal substrate etching is required. Its use extends to photomask cleaning in lithography, where particle-free surfaces are essential for accurate pattern transfer.