Dipentaerythritol Hexakis(3-mercaptopropionate)

≥93%

Reagent Code: #95112
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CAS Number 25359-71-1

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 783.02 g/mol
Formula C₂₈H₄₆O₁₃S₆
badge Registry Numbers
MDL Number MFCD00128217
inventory_2 Storage & Handling
Storage room temperature, dry

description Product Description

Dipentaerythritol Hexakis(3-mercaptopropionate) is widely used as a crosslinking agent in the production of high-performance polymers and resins. Its multiple thiol groups enable it to form strong, durable networks, making it ideal for applications in coatings, adhesives, and sealants where enhanced mechanical properties and chemical resistance are required. Additionally, it is employed in the synthesis of optical materials, such as lenses and films, due to its ability to create transparent, stable structures. In the electronics industry, it serves as a key component in the fabrication of encapsulants and insulating materials, providing protection against moisture and thermal stress. Its versatility also extends to the field of 3D printing, where it is used to improve the strength and flexibility of printed objects.

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Test Parameter Specification
Appearance Colorless to pale yellow liquid
Purity 92.5-100
Refractive Index n20D 1.5310-1.5360
Specific Gravity (20°C) 1.2850-1.2900

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 100g
10-20 days ฿7,200.00
inventory 25g
10-20 days ฿2,580.00
Dipentaerythritol Hexakis(3-mercaptopropionate)
Dipentaerythritol Hexakis(3-mercaptopropionate) is widely used as a crosslinking agent in the production of high-performance polymers and resins. Its multiple thiol groups enable it to form strong, durable networks, making it ideal for applications in coatings, adhesives, and sealants where enhanced mechanical properties and chemical resistance are required. Additionally, it is employed in the synthesis of optical materials, such as lenses and films, due to its ability to create transparent, stable structures. In the electronics industry, it serves as a key component in the fabrication of encapsulants and insulating materials, providing protection against moisture and thermal stress. Its versatility also extends to the field of 3D printing, where it is used to improve the strength and flexibility of printed objects.
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