Bis(4-mercaptophenyl) ether

99%

Reagent Code: #151816
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CAS Number 17527-79-6

science Other reagents with same CAS 17527-79-6

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 234.34 g/mol
Formula C₁₂H₁₀OS₂
badge Registry Numbers
MDL Number MFCD00054506
thermostat Physical Properties
Melting Point 103-104 °C
inventory_2 Storage & Handling
Density 1.265±0.06 g/cm3(Predicted)
Storage Room temperature, seal, dry

description Product Description

Used as a crosslinking agent in high-performance polymers, particularly in the synthesis of thioether-based networks for aerospace and electronic materials. Its dual thiol functionality enables efficient step-growth polymerization with epoxides or maleimides, yielding thermosets with excellent thermal stability and mechanical strength. Commonly applied in advanced composites, encapsulants, and as a curing agent in specialty resins where resistance to thermal degradation is critical. Also explored in the development of photo-patternable materials due to its reactivity in radical-mediated processes.

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Size Availability Unit Price Quantity
inventory 1g
10-20 days ฿2,170.00
inventory 5g
10-20 days ฿7,590.00
inventory 25g
10-20 days ฿26,590.00

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Bis(4-mercaptophenyl) ether
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Used as a crosslinking agent in high-performance polymers, particularly in the synthesis of thioether-based networks for aerospace and electronic materials. Its dual thiol functionality enables efficient step-growth polymerization with epoxides or maleimides, yielding thermosets with excellent thermal stability and mechanical strength. Commonly applied in advanced composites, encapsulants, and as a curing agent in specialty resins where resistance to thermal degradation is critical. Also explored in the

Used as a crosslinking agent in high-performance polymers, particularly in the synthesis of thioether-based networks for aerospace and electronic materials. Its dual thiol functionality enables efficient step-growth polymerization with epoxides or maleimides, yielding thermosets with excellent thermal stability and mechanical strength. Commonly applied in advanced composites, encapsulants, and as a curing agent in specialty resins where resistance to thermal degradation is critical. Also explored in the development of photo-patternable materials due to its reactivity in radical-mediated processes.

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