Used primarily as a reactive diluent and crosslinking agent in radiation-curable coatings and adhesives. It improves adhesion to various substrates and enhances the flexibility and durability of cured films. Commonly found in UV-curable inks, coatings for plastics and metals, and electronic encapsulants due to its low viscosity and good curing efficiency. Also employed in pressure-sensitive adhesives to balance tack and shear strength.