Used as a crosslinker in silicone curing systems, especially in addition-cure silicones for coatings, encapsulants, and sealants. Provides improved thermal stability and flexibility over a wide temperature range. Commonly applied in electronics for protective encapsulation due to its low ionic impurity content and excellent dielectric properties. Also utilized in release coatings, mold-making, and medical devices where biocompatibility and durability are required. Its hydrosilylation reactivity allows for precise control in forming elastomeric networks when catalyzed by platinum complexes.