Used as a reactive diluent in epoxy resin systems to reduce viscosity and improve workability without sacrificing performance. Enhances flexibility and adhesion in coatings, adhesives, and sealants. Commonly employed in composite materials, electrical encapsulation, and flooring systems due to its ability to modify cross-linking density. Also utilized in the formulation of toughened epoxy systems for structural applications. Its terminal epoxy groups enable co-reaction with curing agents, contributing to the final polymer network.