Used as a reactive diluent in epoxy resin systems to reduce viscosity and improve workability without sacrificing performance. Enhances flexibility and impact resistance of cured epoxy formulations. Commonly applied in coatings, adhesives, sealants, and composite materials where improved flow and penetration are required. Its difunctional epoxy structure allows it to participate in the curing reaction, contributing to the crosslinked network. Frequently used in electrical encapsulation, flooring systems, and construction chemicals. Also serves as a modifier in resin formulations to adjust hardness and toughness.