Used primarily as a reactive diluent and crosslinking agent in epoxy resin systems, this compound enhances the thermal stability and mechanical strength of cured polymers. Its rigid molecular structure contributes to high glass transition temperatures (Tg), making it valuable in high-performance composites and electronic encapsulants. Commonly applied in aerospace materials, printed circuit boards, and semiconductor packaging where thermal and dimensional stability are critical. Also utilized in specialty coatings and adhesives requiring superior chemical and heat resistance.