Used as a high-performance diamine monomer in the synthesis of polyimides and polyamides, offering excellent thermal stability and mechanical strength. Commonly applied in aerospace, electronics, and semiconductor industries for manufacturing heat-resistant coatings, adhesives, and insulating materials. Its rigid molecular structure enhances glass transition temperature and reduces dielectric constant, making it suitable for advanced microelectronic packaging and flexible printed circuits. Also investigated for use in gas separation membranes due to its microporosity and chemical resistance.