Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances workability and improves adhesion in coatings, adhesives, and sealants. Commonly added to composite materials and electronic encapsulants for better flow and penetration. Also utilized in the formulation of flexible and toughened epoxy networks due to its ability to modify crosslink density. Suitable for use in aerospace, automotive, and electrical insulation applications where durability and thermal stability are required.