Used primarily as a reducing agent in electroless plating processes, especially in the deposition of nickel-phosphorus and copper coatings on metals and plastics. It enables uniform metal coating without the need for electrical current, making it valuable in manufacturing printed circuit boards and corrosion-resistant finishes. Also employed in analytical chemistry for the detection and reduction of certain metal ions. Its strong reducing capability at low concentrations makes it effective in controlled chemical synthesis and in the preparation of nanomaterials.