Copper plate, 6.35mm thick, 99.9% metals basis
6.35mm thick, 99.9% metals basis
- Product Code: 248468
CAS:
7440-50-8
| Molecular Weight: | 63.55 g./mol | Molecular Formula: | Cu |
|---|---|---|---|
| EC Number: | 231-159-6 | MDL Number: | MFCD00010965 |
| Melting Point: | 1083.4 °C(lit.) | Boiling Point: | 2580 °C |
| Density: | 8.94 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature |
Product Description:
Used as a high-purity conductive material in electrical and electronic applications, such as busbars, grounding systems, and power distribution components. Its uniform thickness and excellent thermal conductivity make it suitable for heat sinks and heat exchangers in industrial and electronic cooling systems. Commonly used in electroplating and as a substrate for printed circuit boards due to its clean, oxide-free surface when properly treated. Also utilized in research and development for material testing, shielding applications, and in the fabrication of custom components requiring precise dimensional tolerance and high electrical performance.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 10X10cm | 10-20 days | ฿15,600.00 |
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Copper plate, 6.35mm thick, 99.9% metals basis
Used as a high-purity conductive material in electrical and electronic applications, such as busbars, grounding systems, and power distribution components. Its uniform thickness and excellent thermal conductivity make it suitable for heat sinks and heat exchangers in industrial and electronic cooling systems. Commonly used in electroplating and as a substrate for printed circuit boards due to its clean, oxide-free surface when properly treated. Also utilized in research and development for material testing, shielding applications, and in the fabrication of custom components requiring precise dimensional tolerance and high electrical performance.
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