Copper plate, 6.35mm thick, 99.9% metals basis
6.35mm thick, 99.9% metals basis
Reagent
Code: #248468
CAS Number
7440-50-8
blur_circular Chemical Specifications
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Molecular Information
Weight
63.55 g/mol
Formula
Cu
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Registry Numbers
EC Number
231-159-6
MDL Number
MFCD00010965
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Physical Properties
Melting Point
1083.4 °C(lit.)
Boiling Point
2580 °C
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Storage & Handling
Density
8.94 g/mL at 25 °C(lit.)
Storage
Room temperature
description Product Description
Used as a high-purity conductive material in electrical and electronic applications, such as busbars, grounding systems, and power distribution components. Its uniform thickness and excellent thermal conductivity make it suitable for heat sinks and heat exchangers in industrial and electronic cooling systems. Commonly used in electroplating and as a substrate for printed circuit boards due to its clean, oxide-free surface when properly treated. Also utilized in research and development for material testing, shielding applications, and in the fabrication of custom components requiring precise dimensional tolerance and high electrical performance.
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