Copper plate, 6.35mm thick, 99.9% metals basis

6.35mm thick, 99.9% metals basis

Reagent Code: #248468
fingerprint
CAS Number 7440-50-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 63.55 g/mol
Formula Cu
badge Registry Numbers
EC Number 231-159-6
MDL Number MFCD00010965
thermostat Physical Properties
Melting Point 1083.4 °C(lit.)
Boiling Point 2580 °C
inventory_2 Storage & Handling
Density 8.94 g/mL at 25 °C(lit.)
Storage Room temperature

description Product Description

Used as a high-purity conductive material in electrical and electronic applications, such as busbars, grounding systems, and power distribution components. Its uniform thickness and excellent thermal conductivity make it suitable for heat sinks and heat exchangers in industrial and electronic cooling systems. Commonly used in electroplating and as a substrate for printed circuit boards due to its clean, oxide-free surface when properly treated. Also utilized in research and development for material testing, shielding applications, and in the fabrication of custom components requiring precise dimensional tolerance and high electrical performance.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 10X10cm
10-20 days ฿15,600.00

Cart

No products

Subtotal: 0.00
Total 0.00 THB