Used as a precursor in the production of high-performance polyimide films and coatings. These materials are valued for their excellent thermal stability, mechanical strength, and resistance to chemicals, making them ideal for aerospace, microelectronics, and flexible circuit boards. The amic acid solution is typically applied via spin coating or casting, then thermally or chemically imidized to form the final polyimide. It is especially useful in semiconductor packaging and as a dielectric layer in integrated circuits. Its ability to adhere well to various substrates and maintain performance under extreme conditions enhances its role in demanding industrial and electronic applications.