PF2825

98%

Reagent Code: #227920
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CAS Number 153012-65-8

science Other reagents with same CAS 153012-65-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 420.52 g/mol
Formula C₂₁H₂₈N₂O₅S
inventory_2 Storage & Handling
Storage 2-8°C, avoiding light

description Product Description

Used primarily as a specialty solvent in electronic materials processing, particularly in the production of semiconductor devices. Its unique solvating properties make it effective in photoresist stripping and cleaning processes, where it helps remove organic residues without damaging sensitive components. Exhibits thermal stability and low toxicity, which supports its use in high-precision manufacturing environments. Also utilized in formulations for lithography due to its compatibility with various photoresist systems. Its low surface tension allows for effective penetration into fine circuit patterns, enhancing cleaning efficiency.

Available Sizes & Pricing

Size Availability Unit Price Quantity
50mg
10-20 days ฿19,350.00
100mg
10-20 days ฿27,150.00
250mg
10-20 days ฿63,340.00
PF2825
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Used primarily as a specialty solvent in electronic materials processing, particularly in the production of semiconductor devices. Its unique solvating properties make it effective in photoresist stripping and cleaning processes, where it helps remove organic residues without damaging sensitive components. Exhibits thermal stability and low toxicity, which supports its use in high-precision manufacturing environments. Also utilized in formulations for lithography due to its compatibility with various pho

Used primarily as a specialty solvent in electronic materials processing, particularly in the production of semiconductor devices. Its unique solvating properties make it effective in photoresist stripping and cleaning processes, where it helps remove organic residues without damaging sensitive components. Exhibits thermal stability and low toxicity, which supports its use in high-precision manufacturing environments. Also utilized in formulations for lithography due to its compatibility with various photoresist systems. Its low surface tension allows for effective penetration into fine circuit patterns, enhancing cleaning efficiency.

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